Technical capabilities
Processing technology
At the Urawa Plant, we quickly respond to the processing of a wide variety of products and prototypes with various magnet cutters such as slicers and inner peripheral slicers, and various polishing machines such as double-headed flat surface grinding machines, centerless grinding machines, and inner diameter grinding machines. increase.
Inner circumference slicer
An inner circumference slicer suitable for cutting thin materials.In addition, there are few processing machines in Japan, such as a slicer that can cut into any shape and an inner diameter grinding machine that polishes the inner diameter surface of the ring.
Making full use of these special processing machines, various magnets are processed with skillful technology, which enables rapid product processing and prototype production regardless of overseas.
Inner circumference slicer suitable for cutting thin materials
Main installation machines of Urawa factory
- 1 inner slicer
- Inner diameter grinding machine 2 units Slicer 5 units
- 1 double-headed surface grinding machine
- 2 centerless grinding machines
- 1 vertical grinding machine 1 barrel grinding machine
Slicer and various polishing machines
Slicer
Can be cut into any shape
Double-headed surface grinding machine
Polish the thickness
Centerless grinding machine
Polish the outer peripheral surface of a round object
Inner diameter grinding machine
Polishes the inner peripheral surface of the ring shape